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机械工程与力学学院

Soft Materials, Electronics and Machines--from Tunable Surfaces to Emerging Electronics to Medical Devices

作者:   已浏览:次  更新日期:2018-12-24

宁波大学 力学与工程科术 报告
Lecture Series on Mechanics and Engineering Science, Ningbo University
2018年12月25日,星期二,9:30AM
绣山工程大楼208室
Title:Soft Materials, Electronics and Machines
- from Tunable Surfaces to Emerging Electronics to Medical Devices
Dr. Changyong Cao
Laboratory for Soft Machines and Electronics
Departments of Packaging, Mechanical Engineering, Electrical and Computer Engineering
Michigan State University
Abstract Soft materials, such as polymers, foams and hydrogels, can deform easily and to very large strains. Their shapes and sizes can vary greatly even if the applied forces are small. Different from “hard materials”, soft materials have very different and unique properties, which may have potential applications in various fields but have been much less explored. This offers people great opportunities for making breakthrough discoveries and inventions in engineering and medicine. Moreover, a combination of soft and hard materials could enable people to develop unprecedented functions of machines, structures and devices, for example, self-organized patterns and soft robotics and self-folding structures. In this talk, I will present some work we have done in the field of mechanics and physics of soft materials and nanomaterials, particularly the mechanical instability of thin film-substrate system, the printed, flexible and stretchable electronics, and the innovative biomedical devices. I will first describe how we use numerical and experimental methods to identify the instability modes and the scaling laws for generating tunable surfaces patterns. Then, I will demonstrate how to harness mechanical instabilities and large deformations from soft materials to develop stretchable supercapacitors and novel medical devices. Finally, I will show our recent efforts in developing robust, smart and sustainable packaging system with engineered materials and technologies.
曹长勇博士毕业于澳大利亚国立大学机械工程与材料科学专业,目前担任美国密西根州立大学包装系、机械工程系和电气与计算机工程系助理教授、软体机器与柔性电子实验室主任。主要研究方向为软材料与纳米材料力学、可穿戴及印刷电子器件、智能包装及物联网、3D/4D打印材料与技术、软体机器人及医疗器械等。至今已在Nature Biotechnology, Advanced Materials, Advanced Science, Advanced Electronic Materials, Energy & Environmental Science, ACS Nano, Small等国际一流期刊上发表论文40余篇,其中多项科研成果被Science Daily, MIT News, Phys.org, Science Newsline, Nanowerk等新闻媒体广泛关注和报道。曹博士先后荣获多项科研奖励及荣誉,包括国家优秀自费留学生、美国杜克大学杰出博士后、澳大利亚国立大学校长奖、全美计算力学大会优秀奖、世界材料科学大会最佳墙报奖、IEEE优秀会议论文奖等。目前受邀担任30多个国际知名期刊的审稿人,是美国国家自然科学基金、智利国家科学与技术委员会等多个机构的特邀评审专家。
更更多信息: 0574 8760 0303, wangji@nbu.edu.cn

 
 
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