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RF Acoustic MEMS Transducers for Microsystems-on-a-Chip

已浏览:次 文/图: 更新日期:2018年05月14日

2018年5月17日,星期四,1:30PM

绣山工程大楼208室

RF Acoustic MEMS Transducers for Microsystems-on-a-Chip

Prof. Jing Wang 王京

University of South Florida, Tampa, FL

       jingw@usf.edu

Abstract

Firstly, this talk will being with discussion of design, fabrication, modeling and testing of high-Q on-chip micromechanical resonators for wireless communications and sensing applications. The recent progress in the area of high-Q micromechanical resonators, filters and oscillators will be overviewed, which outperform the current state-of-the-art SAW and FBAR devices, thus enabling the next generation of multi-frequency, multi-mode and single-chip transceivers. Also, this talk will review recent research efforts for implementation of chip-scale sensing platforms such as MEMS acoustic emission sensors that is designed to outperform and replace the quite bulky piezoelectric transducers for continuous, real-time nondestructive testing (NDT) of civil and aerospace structures (pressure vessels, bridges, buildings, and so on). The ability to integrate a few miniaturized, low-power capacitive sensor to form an array enable such acoustic emission sensor arrays to be used for continuous NDT monitoring and imaging. Finally, this talk will be concluded with a brief overview of other ongoing research activities such IC/MEMS chip integration and packaging of microchips at microwave frequencies by 3D printing.

Dr. Jing Wang got dual B.S. degrees from Tsinghua University. He received two M.S. degrees, and a Ph.D. degree from University of Michigan. He has been awarded more than $9M by research grants from federal agencies (NSF, DTRA, US Army, US Air Force, etc.) and contracts from more than a dozen companies. He has published more than 120 peer-reviewed articles, while holding 9 US patents. He serves as the chairperson for IEEE MTT/AP/EDS Florida West Coast Section and Co-Director for the Wireless and Microwave Information (WAMI) Center. He has been elected as a member of the prestigious IEEE MTT-21Technical Coordinating Committee on RF MEMS. He has chaired IEEE Wireless and Microwave Technology Conferences between 2011 and 2015 for five years.

 
 
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