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密歇根州立大学机械工程系曹长勇教授到我院做学术报告

作者:   已浏览:次  更新日期:2018-12-26

    应宁波大学机械工程与力学学院邀请,密西根州立大学(Michigan State University)包装系、机械工程系和电气与计算机工程系助理教授、软体机器与柔性电子实验室主任曹长勇教授20181225日星期二来我院做学术报告,报告题目Soft Materials, Electronics and Machines- from Tunable Surfaces to Emerging Electronics to Medical Devices。曹长勇教授至今已在Nature Biotechnology, Advanced Materials, Advanced Science, Advanced Electronic Materials, Energy & Environmental Science, ACS Nano, Small等国际一流期刊上发表论文40余篇,其中多项科研成果被Science Daily, MIT News, Phys.org, Science Newsline, Nanowerk等新闻媒体广泛关注和报道。

曹长勇教授主要向学院师生介绍了其研究团队在力学和物理领域对纳米软材料的研究成果。内容主要包括薄膜基底系统的机械不稳定研究、可伸缩性柔性软体材料力学与机械性能研究,和新型生物医学设备研制。曹教授首先介绍了通过实验和仿真研究分析了软材料的六种失稳模式以及产生可调控表面的理论研究。然后,曹教授介绍了如何利用软材料的机械不稳定性和大变形等特点研发可伸展的超级电容器和新型医疗设备。最后,曹教授展示了其研究团队在工程材料和技术领域发展稳定,智能及可持续使用的包装系统的最新成果。

曹长勇教授的报告吸引了很多学院的师生前来参加报告厅里座无虚席观众对他的介绍反应热烈不时有深入的讨论和问题。这次报告也吸引了学校之外的许多听众反映了大家对曹博士的研究工作的高度关注

Soft Materials, Electronics and Machines

- from Tunable Surfaces to Emerging Electronics to Medical Devices

Invited by the School of Mechanical Engineering and Mechanics of Ningbo University, Prof. Changyong Cao from Departments of Packaging, Mechanical Engineering, Electrical and Computer Engineering, Michigan State University, presented a talk entitled "Soft Materials, Electronics and Machines " to a broad audience of researchers and graduate students on Dec. 25, 2018.

Prof. Cao presented some work that his laboratory has done in the field of mechanics and physics of soft materials and nanomaterials, particularly the mechanical instability of thin film-substrate system, the printed, flexible, and stretchable electronics, and the innovative biomedical devices. He first described how they used numerical and experimental methods to identify the instability modes and the scaling laws for generating tunable surfaces patterns. Then, he demonstrated how to harness mechanical instabilities and large deformations from soft materials to develop stretchable supercapacitors and novel medical devices. Finally, he showed their recent efforts in developing robust, smart and sustainable packaging system with engineered materials and technologies.

 
 
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